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april 2009 doc id 15614 rev 1 1/15 15 SPZB260-PRO zigbee ? module features integrated 2.4 ghz, ieee 802,15,4-compliant transceiver: ? 3 dbm nominal tx output power ? -95 dbm rx sensitivity ? + 5 dbm in boost mode ? rx filtering for co-existence with ieee 802.11g and bluetooth devices ? integrated vco and loop filter integrated ieee 80 2.15.4 phy and mac controlled by a standard serial line for an easy interface of host microcontrollers (spi) embedded flash and integrated ram for program and data storage on board 24 mhz stable crystal integrated rc oscillator (typ. 10 khz) for low power operation 1 a power consumption in deep sleep mode watchdog timer and power-on reset pins available for non-intrusive debug interface (sif) single supply voltage 2.1 to 3.6 vdc available link and activity outputs for external indication / monitor ce compliant (a) fcc compliant (fcc id:s9nzb260a) (a) applications industrial controls sensor networking monitoring of remote systems home applications security systems lighting controls description SPZB260-PRO is a low power consumption zigbee? module optimized for embedded applications. it enables oems to easily add wireless capability to electronic devices. the module is based on sn260 zigbee? network processor wh ich integrates a 2.4 ghz, ieee 802.15.4-compliant tran sceiver as well as ieee 802.15.4 phy and mac. 24 mhz high stability crystal is integrated in the module to perform the timing requirements as per zigbee? specifications. a single supply voltage is requested to power the module. a 2.5 ghz specific murata antenna is integrated in the module. the voltage supply determines the i/o ports level allowing an easy interface with the host system. the module is controlled by means of a standard serial interface (spi) allowing the connections to a variety of host microcontrollers. for other information and details, please refer to sn260 datasheet available at www.st.com a. SPZB260-PRO is based on the same unmodified hw of spzb260 module. the same certification statements apply. www.st.com
contents SPZB260-PRO 2/15 doc id 15614 rev 1 contents 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.1 dc electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.2 dc i/o specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.3 rf electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 appendix a fcc statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 a.1 label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 a.2 special requirement for modular application . . . . . . . . . . . . . . . . . . . . . . . 12 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPZB260-PRO block diagram doc id 15614 rev 1 3/15 1 block diagram figure 1. block diagram 2 pin settings 2.1 pin connections figure 2. pin connection diagram 24 mhz xtal sn 260 tranceiver balun filter vdd sif spi c ontr sign rf antenna
pin settings SPZB260-PRO 4/15 doc id 15614 rev 1 2.2 pin description table 1. pin description pin n pin name direction description 1 rstb i active low reset (an internal pull-up of 30 k typ. is provided) 2 host_int o host interrupt signal (from zb module to host) 3 spi_ssel i spi slave select (from host to zb module) 4 spi mosi i spi data, master out / sl ave in (from host to zb module) 5 spi miso o spi data, master in / slave out (from zb module to host) 6 spi_clk i spi clock 7 gnd --- ground 8 v dd --- input power supply 9sif_clk i non-intrusive debug interface serial interface clock signal (internal pull-down) 10 sif_miso o non-intrusive debug interface serial interface master in/ slave out 11 sif_mosi i non-intrusive debug interface serial interface master out/ slave in to guarantee a proper signal level when in deep sleep mode connect a 10 k resistor to gnd 12 sif_loadb i/o non-intrusive debug interface serial interface load strobe (open collector with internal pull-up) to improve noise immunity connect a 10 k resistor to v dd 13 pti_en o frame signal of packet trace interface (pti) 14 pti_data o data signal of packet trace interface (pti) 15 wake i wake interrupt signal from host to zb module 16 activity o activity signal for application debug /monitor 17 sdbg o
SPZB260-PRO maximum ratings doc id 15614 rev 1 5/15 3 maximum ratings 3.1 absolute maximum ratings 3.2 operating ranges table 2. absolute maximum ratings symbol parameter values unit min. max. v dd module supply voltage -0.3 3.6 v v in input voltage on any digital pin -0.3 vdd+0.3 v t stg storage temperature -40 +85 c t sold soldering temperature < 10 s 240 table 3. operating ranges symbol parameter conditions values unit min. typ. max. v dd module supply voltage - 40 c < t < 85 c 2.1 3.3 3.6 v t stg operating ambient temperature -40 +85 c
electrical characteristics SPZB260-PRO 6/15 doc id 15614 rev 1 4 electrical characteristics 4.1 dc electrical characteristics 4.2 dc i/o specification table 4. dc electrical characteristics symbol parameter conditions values unit min. typ. max. irx rx current (boost mode) vdd = 3.0 v, t = 25 c - 38 ma irx rx current (normal mode) vdd = 3.0 v, t = 25 c - 36 ma itx tx current (boost mode) vdd = 3.0 v, t = 25 c - 42 ma itx tx current (normal mode) vdd = 3.0 v, t = 25 c - 36 ma ids deep sleep current 2.1 < vdd < 3.6 v t = 25c -1 a table 5. dc input / output specification symbol parameter conditions values unit min. typ. max. vil low level input voltage 2.1 < vdd < 3.6 v 0 0.2 x vdd v vih high level input voltage 2.1 < vdd < 3.6 v 0.8 x vdd vdd v iil input current for logic 0 2.1 < vdd < 3.6 v -0.5 ma iih input current for logic 1 2.1 < vdd < 3.6 v 0.5 ma ripu input pull-up resistor 30 k ripd input pull-down resistor 30 k vol low level output voltage 0 0.18 x vdd v voh high level output voltage 0.82 x vdd vdd v iohs output source current 4 ma iols output sink current 4 ma iohh output source current (pin 15,16,17) 8 ma iolh output sink current (pin 15,16,17) 8 ma iotot total output current for i/o 40 ma
SPZB260-PRO electrical characteristics doc id 15614 rev 1 7/15 4.3 rf electrical characteristics table 6. rf electrical characteristics symbol parameter conditions values unit min. typ. max. frequency range 2.1 < vdd < 3.6 v 2405 2480 mhz tx output power vdd = 3.0 v, f = 2450 mhz 3 dbm rx sensitivity vdd = 3.0 v, 1% per -95 dbm cfe carrier frequency error vdd = 3.0 v -20 / + 70 c -40 40 ppm error vector magnitude normal / boost mode 15 25 % adjacent channel rejection +/- 5 mhz +/- 10 mhz 35 40 dbm
package mechanical dimensions SPZB260-PRO 8/15 doc id 15614 rev 1 5 package mechanical dimensions in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 3. mechanical dimensions
SPZB260-PRO package mechanical dimensions doc id 15614 rev 1 9/15 figure 4. solder pad layout
soldering SPZB260-PRO 10/15 doc id 15614 rev 1 6 soldering soldering phase has to be execute with care: in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the peak temperature. here following some suggestions for the temperature profile based on ipc/jedec j-std-020c, july 2004 recommendations. figure 5. soldering table 7. soldering profile feature pb free assembly average ramp up rate (t smax to t p ) 3 c / sec max preheat temperature min (t s min ) temperature max (t s max ) time (t s min to t s max ) (t s ) 150 c 200 c 60 ? 100 sec time maintained above: temperature t l time t l 217 c 40 ? 70 sec peak temperature (tp) 240+0 c time within 5 c of actual peak temperature (t p ) 10 ? 20 sec ramp down rate 6 c / sec time from 25 c to peak temperature 8 minutes max
SPZB260-PRO fcc statement doc id 15614 rev 1 11/15 appendix a fcc statement (b) this device complies with part 15 of the fcc ru les. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. note: this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarant ee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna increase the separation between the equipment and receiver connect the equipment into an outlet on a circuit different from that to which the receiver is connected consult the dealer or an experienced radio/tv technician for help. antenna our module type spzb260 is for oem integr ations only. the end-user product will be professionally installed in such a manner that only the authorized antennas are used. caution any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with fcc rules part 15, and thus void the user?s authority to operate the equipment. b. SPZB260-PRO is based on the same unmodified hw of spzb 260 module. the same fcc certification statement applies.
fcc statement SPZB260-PRO 12/15 doc id 15614 rev 1 a.1 label instruction instruction manual for fcc id labeling module type: zigbee? module spzb260 fcc-id: s9nzb260a this intends to inform you how to specify the fcc id of our zigbee? module spzb260 on your final product. based on the public notice from fcc, the product into which our transmitter module is installed must display a label referring to the enclosed module. the label should use wording such as ?contains transmitter module fcc id: s9nzb260a or ?contains fcc id: s9nzb260a, any similar wording that expressed the same meaning may be use. it shows an example below a.2 special requirement for modular application the following requirements are fulfilled: 1. the modular transmitter must have its own rf shielding: the rf module used on the board fulfils the emission requirements of the fcc rules without additional shielding. 2. the modular transmitter must have buffered modulation/data inputs: the module has a memory management unit inside of the ic. the processor interfacing with the external application by means general purpose i/o (gpio), uart, spi. the processor interfaces also the rf part of the module exchanging data and command with it. inside the processor a flash memory is available to download the customer application and the zigbee? profiles. 3. the modular transmitter must have its own power supply regulation: the ic contains an own voltage regulation. in case of changes in the supply voltage vcc (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4. the modular transmitter must comply with the antenna requirements of section 15.203 and 15.204: the rf module is for oem (original equipment manufacturer) integration only. the end- user product will be professionally installed in such a manner that only the authorized antenna is used. 5. the modular transmitter must be tested in a stand-alone configuration: the rf module was tested in a stand-alone configuration. 6. the modular transmitter must be la belled with its own fcc id number: the rf module will be labelled with its ow n fcc id number. when the module is installed inside the end-product, the label is not visible. the oem manufacturer is instructed how to apply the exterior label. contains fcc id: s9nzb260a
SPZB260-PRO fcc statement doc id 15614 rev 1 13/15 7. the modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: the eut is compliant with all applicable fcc rules. detail instructio ns are given in the product users guide. 8. the modular transmitter must comply with any applicable rf exposure requirements. ? maximum measured power output: 3,08 mw ? maximum antenna gain: 0,6 dbi = numeric gain 1,148 (see also fcc test report) maximum permissible exposure defined in 47 cfr 1.1310: 1 mw/cm2. the rf module operates at low power level so it does not exceed the commission?s rf exposure guidelines limits; furthermore, spread spectrum transmitters operate according to the section 15.247 are categorically excluded from routine environmental evaluation.
revision history SPZB260-PRO 14/15 doc id 15614 rev 1 7 revision history table 8. document revision history date revision changes 22-apr-2009 1 first release
SPZB260-PRO doc id 15614 rev 1 15/15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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